English

China

Tel:13925851538

ELECTRONIC SURFACE TREATMENT MATERIAL SUPPLIER

The company integrates R&D, production and sales

Home > process

Aluminum Plating

Aluminum Plating

Aluminum plating involves coating a metal or alloy surface with aluminum, typically using electroplating or electroless plating techniques.

Productprocess flowTDSMSDSID:
Cleaning & Passivation of Alum

Cleaning & Passivation of Alum

Aluminum rapidly forms a thin, inert native aluminum oxide layer upon exposure to air. Copper tends to oxidize, develop tarnish, and generate copper‑containing corrosion residues. When both metals co‑exist on one part, galvanic corrosion risk arises during wet chemical processing. Improper cleaning leaves oils, cutting fluids, fingerprints, oxide films and inter‑metallic smuts.

Productprocess flowTDSMSDSID:
Alum Copper Replacement

Alum Copper Replacement

From electrical wiring and power transmission to EVs, solar systems, aerospace, and electronics. It visually compares aluminum’s lightweight, cost‑efficient advantages against copper’s traditional conductivity. This concept is increasingly relevant for industries seeking eco‑friendly and cost‑optimized materials. Aluminum’s lower density and corrosion resistance make it ideal for power transmission lines, EV busbars, and heat sinks.

Productprocess flowTDSMSDSID:
Copper-Alum Composite Material

Copper-Alum Composite Material

Copper-aluminum composite material is a laminated bimetallic material where pure copper and aluminum alloy are tightly bonded at the atomic level via metallurgical composite processes. It is not merely laminated or glued together, and a stable diffusion layer forms at the bonding interface, preventing delamination during bending, stamping and heat treatment.

Productprocess flowTDSMSDSID:
electroless copper

electroless copper

Productprocess flowTDSMSDSID:
SF—ENIG*ENEPIG* Immersion Tin &OSP

SF—ENIG*ENEPIG* Immersion Tin &OSP

Productprocess flowTDSMSDSID:
NAMI microporous foaming particles

NAMI microporous foaming particles

Productprocess flowTDSMSDSID:
NAMI Hybrid High Barrier PP

NAMI Hybrid High Barrier PP

Productprocess flowTDSMSDSID:
Analysis &Dosing  Equipment

Analysis &Dosing Equipment

Productprocess flowTDSMSDSID:
Aluminum Cover Sheet & Wood Fiber &Phenolic Back-up BoardBack-up Board

Aluminum Cover Sheet & Wood Fiber &Phenolic Back-up BoardBack-up Board

Aluminum Cover Sheet & Wood Fiber Back-up Board & Phenolic Back-up Board for PCB Drilling

Productprocess flowTDSMSDSID:
Zincate process

Zincate process

Aluminum surfaces oxidize extremely readily and cannot be electroplated directly. Through displacement reaction in zincate solution, an ultra-thin zinc film is deposited on aluminum to act as an intermediate barrier layer, significantly improving the adhesion of subsequent nickel and copper coatings.

Productprocess flowTDSMSDSID:
Total7Pages,103Items FirstPage PreviousPage NextPage LastPage Jump

ABOUT US

PROCESS

DONGGUAN SOMEI

HONGKONG SOMEI

CopyRight 2026 All Right Reserved DongGuan SOMEI Electronic Material Technology Co., Ltd