ELECTRONIC SURFACE TREATMENT MATERIAL SUPPLIER

Substrate Considerations

Most industrial aluminum plating is performed on aluminum alloys rather than pure aluminum, as alloys like aluminum-magnesium or aluminum-silicon provide better mechanical properties and are easier to plate  Wrought alloys are commonly used for foils, extrusions, and rolled plates, while cast alloys are chosen for cost-effective applications with lower tensile strength requirements  Proper surface pretreatment, such as zincate processes, is essential to ensure adhesion and uniform coating 

Common Plating Metals

• Tin: Cost-effective, corrosion-resistant, and electrically conductive; often used for electronic components 
• Nickel: Increases hardness, wear resistance, and corrosion protection; suitable for industrial and aerospace applications 
• Silver: Enhances surface conductivity and corrosion resistance; used in energy and electronics industries 
• Gold: Provides biocompatibility and prevents oxide formation; ideal for medical devices 
• Electroless Nickel: Offers uniform coating, excellent corrosion resistance, and serves as a base for further plating 

This process can produce dense, pore-free coatings ranging from 10 to over 100 micrometers in thickness 

Aluminum Plating Process Flow

The aluminum plating process flow typically includes the following steps:

8.Drying: Drying the plating to ensure proper adhesion and durability.