Matte Tin
Matt tin plating is the premier functional finishing choice for high-reliability electronic components. Compared with bright tin, it offers better solderability retention, anti-whisker stability and mechanical contact performance. It is widely used in automotive terminals, PCB connectors, precision switches, sensor pins and long-shelf-life electronic parts.
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Tin Cobalt
Tin-cobalt alloy plating is a high-performance environmentally friendly substitute for decorative nickel and chromium plating. It combines decorative aesthetics, anti-allergy safety and functional durability, becoming the mainstream surface finish for fashion hardware, 3C electronic accessories, automotive interior parts and sanitary ware.
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Neutraliser POP
POP Neutralizer acts as a process bridge between chemical etching/activation and electroless plating. It cleans, neutralizes, stabilizes and purifies the plastic surface, guaranteeing high-yield, high-adhesion and defect-free metal plating on non-conductive plastic materials.
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Activator POP
POP Activator is the core catalytic driver of plastic metallization. It converts non-conductive plastic into a catalytically active surface, enabling the entire electroless and electroplating sequence. Its formula stability and activation uniformity directly determine the adhesion, coverage, smoothness and yield of finished POP plating products.
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Chrome Plating on Plastics
Chrome plating on plastics creates a durable, reflective metal-like finish by first making the non-conductive plastic surface conductive and then electroplating chromium.
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ABS Plastic Base
Plating on plastics, also known as Plastic Electroplating (POP), involves making a non-conductive plastic surface suitable for metal deposition. The process apply a metal coating to a plastic substrate to enhance appearance, durability, conductivity, and corrosion resistance.
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Strike Acid Copper
Strike Acid Copper, also known as acid copper flash strike, is a thin, high-adhesion pre-copper plating process applied immediately after substrate activation. Unlike thick bright acid copper plating used for leveling and build-up, acid copper strike is a low-thickness, high-density transitional layer specifically engineered for poor-adhesion substrates, including stainless steel, hardened steel, titanium, and low-activity alloy surfaces. It serves as a critical bonding bridge between the base metal and subsequent...
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Bright Acid Copper
Bright Acid Copper Plating is a high-precision electrochemical surface treatment using sulfate-based acidic electrolyte with professional organic brightener, leveler and carrier additive systems. It deposits a mirror-bright, ultra-smooth, low-stress pure copper layer on metal substrates. Widely used as a premium intermediate undercoat for nickel, tin, gold and silver plating, it is also applied for decorative bright finishing and high-conductivity electronic component metallization
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Microporous Nickel Strike
Micro Porous Nickel Strike is a specialized ultra-thin nickel underlayer used in premium bright nickel plating systems. Unlike conventional dense nickel strike, it forms a controlled micro-porous crystalline structure with uniform microscopic pores across the entire substrate surface. It acts as a critical transition bonding layer between the base metal and the thick bright nickel topcoat, widely applied for high-adhesion, anti-corrosion precision plating.
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