IC leads plating
IC lead frame and lead plating is a core surface finishing process in semiconductor packaging. Functional metal coatings are electroplated onto the metallic leads of integrated circuits to improve solderability, resist oxidation and corrosion, strengthen wire bonding performance, and optimize electrical and thermal conductivity, Copper alloy lead frames (C194, C7025, etc.); Typical plating layers: pre-nickel strike, microporous nickel, bright tin, matte tin, tin-bismuth alloy, palladium-nickel, gold, silve...
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Wire Plating
Wire plating refers to a continuous electroplating process for metal wires. Using long metal wires such as copper, brass and stainless steel wire as substrates, a uniform metal coating is electrolytically deposited on the wire surface during high-speed continuous wire feeding. This process adopts a continuous roll-to-roll electroplating production line.
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LED plating
LED plating, full name LED lead frame/stencil plating, is a core surface finishing process for LED packaging.
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Dry Acid Salt
Dry Acid Salt is for providing superior degreasing and surface preparation. Come in dry powder and liquids, to reove rust , scale oxides , stains and smut from metal surfaces.
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Acid Inhibitor
Acid inhibitors for pretreatment are essential compounds that prevent the attack of acids on substrates during the pretreatment process.
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